Vulnerability Details : CVE-2023-33057
Transient DOS in Multi-Mode Call Processor while processing UE policy container.
Vulnerability category: Input validationDenial of service
Products affected by CVE-2023-33057
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9360_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx57m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg8275p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:315_5g_iot_modem_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x65_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x70_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_compute_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_690_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_695_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_750g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_480\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_765g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_768g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_780g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_765_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_778g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_778g\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_782g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6224_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6274_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qfw7114_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qfw7124_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qualcomm_video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_4_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x75_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855\+\/860_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_gen_2_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qep8111_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x35_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2023-33057
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 11 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2023-33057
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.5
|
HIGH | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H |
3.9
|
3.6
|
Qualcomm, Inc. | 2024-02-06 |
CWE ids for CVE-2023-33057
-
The product receives input or data, but it does not validate or incorrectly validates that the input has the properties that are required to process the data safely and correctly.Assigned by:
- nvd@nist.gov (Primary)
- product-security@qualcomm.com (Secondary)
References for CVE-2023-33057
-
https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
Security Bulletins | Qualcomm DocumentationVendor Advisory
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