Vulnerability Details : CVE-2023-33040
Transient DOS in Data Modem during DTLS handshake.
Vulnerability category: Denial of service
Products affected by CVE-2023-33040
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3990_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd730_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9326_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9360_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9371_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3910_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x\+sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx57m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4325_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:315_5g_iot_modem_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x24_lte_modem_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x50_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x65_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x70_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_4g_modem_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:smart_audio_400_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_675_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8c_compute_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8cx_compute_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8cx_gen_2_5g_compute_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_compute_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_690_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_695_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_750g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_480\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_665_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_678_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_720g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_730g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_732g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_765g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_768g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_7c_compute_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_7c_gen_2_compute_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_780g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_730_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_765_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_778g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_778g\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_782g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855\+\/860_mobile_platform_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2023-33040
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 11 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2023-33040
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.5
|
HIGH | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H |
3.9
|
3.6
|
Qualcomm, Inc. | 2024-01-02 |
CWE ids for CVE-2023-33040
-
The product reads from a buffer using buffer access mechanisms such as indexes or pointers that reference memory locations after the targeted buffer.Assigned by: product-security@qualcomm.com (Secondary)
References for CVE-2023-33040
-
https://www.qualcomm.com/company/product-security/bulletins/january-2024-bulletin
Security Bulletins | Qualcomm DocumentationVendor Advisory
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