Vulnerability Details : CVE-2023-28561
Memory corruption in QESL while processing payload from external ESL device to firmware.
Vulnerability category: OverflowMemory Corruption
Products affected by CVE-2023-28561
- cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2023-28561
0.14%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 51 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2023-28561
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
9.8
|
CRITICAL | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
3.9
|
5.9
|
NIST | |
9.8
|
CRITICAL | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
3.9
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2023-28561
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: product-security@qualcomm.com (Secondary)
-
The product writes data past the end, or before the beginning, of the intended buffer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2023-28561
-
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
Security Bulletins | Qualcomm DocumentationVendor Advisory
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