Vulnerability Details : CVE-2023-21635
Memory Corruption in Data Network Stack & Connectivity when sim gets detected on telephony.
Vulnerability category: OverflowMemory Corruption
Products affected by CVE-2023-21635
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855\+\/860_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_wear_4100\+_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x55_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_4g_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2023-21635
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 9 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2023-21635
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST | |
6.7
|
MEDIUM | CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H |
0.8
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2023-21635
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: product-security@qualcomm.com (Secondary)
-
The product writes data past the end, or before the beginning, of the intended buffer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2023-21635
-
https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
Security Bulletins | Qualcomm DocumentationVendor Advisory
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