Vulnerability Details : CVE-2022-33217
Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile
Vulnerability category: OverflowMemory Corruption
Products affected by CVE-2022-33217
- cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2022-33217
0.06%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 16 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2022-33217
| Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
|---|---|---|---|---|---|---|
|
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST | |
|
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2022-33217
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: nvd@nist.gov (Primary)
References for CVE-2022-33217
-
https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
Qualcomm DocumentationVendor Advisory
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