Vulnerability Details : CVE-2022-22095
Memory corruption in synx driver due to use-after-free condition in the synx driver due to accessing object handles without acquiring lock in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Vulnerability category: Memory Corruption
Products affected by CVE-2022-22095
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9326_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3615_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3910_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd680_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2022-22095
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 11 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2022-22095
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST | |
8.4
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
2.5
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2022-22095
-
The product reuses or references memory after it has been freed. At some point afterward, the memory may be allocated again and saved in another pointer, while the original pointer references a location somewhere within the new allocation. Any operations using the original pointer are no longer valid because the memory "belongs" to the code that operates on the new pointer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2022-22095
-
https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
Qualcomm DocumentationPatch;Vendor Advisory
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