Vulnerability Details : CVE-2022-22071
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Vulnerability category: Memory Corruption
Products affected by CVE-2022-22071
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9326_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3615_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3910_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3999_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx12_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx65_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd680_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd695_firmware:-:*:*:*:*:*:*:*
CVE-2022-22071 is in the CISA Known Exploited Vulnerabilities Catalog
CISA vulnerability name:
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
CISA required action:
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
CISA description:
Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
Notes:
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/586840fde350d7b
Added on
2023-12-05
Action due date
2023-12-26
Exploit prediction scoring system (EPSS) score for CVE-2022-22071
0.65%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 70 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2022-22071
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.2
|
HIGH | AV:L/AC:L/Au:N/C:C/I:C/A:C |
3.9
|
10.0
|
NIST | |
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST | |
8.4
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
2.5
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2022-22071
-
The product reuses or references memory after it has been freed. At some point afterward, the memory may be allocated again and saved in another pointer, while the original pointer references a location somewhere within the new allocation. Any operations using the original pointer are no longer valid because the memory "belongs" to the code that operates on the new pointer.Assigned by:
- 134c704f-9b21-4f2e-91b3-4a467353bcc0 (Secondary)
- nvd@nist.gov (Primary)
References for CVE-2022-22071
-
https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin
Qualcomm DocumentationPatch;Vendor Advisory
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