Vulnerability Details : CVE-2021-30350

Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Published 2022-06-14 10:15:15
Updated 2023-04-19 17:10:55
Source Qualcomm, Inc.
View at NVD,   CVE.org
Vulnerability category: OverflowMemory Corruption

Products affected by CVE-2021-30350

Exploit prediction scoring system (EPSS) score for CVE-2021-30350

EPSS FAQ
0.14%
Probability of exploitation activity in the next 30 days EPSS Score History
~ 31 %
Percentile, the proportion of vulnerabilities that are scored at or less

CVSS scores for CVE-2021-30350

Base Score Base Severity CVSS Vector Exploitability Score Impact Score Score Source First Seen
7.2
 HIGH AV:L/AC:L/Au:N/C:C/I:C/A:C
3.9
10.0
 NIST
7.8
 HIGH CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
1.8
5.9
 NIST
8.4
 HIGH CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
2.5
5.9
 Qualcomm, Inc.

CWE ids for CVE-2021-30350

  • The product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.
    Assigned by: nvd@nist.gov (Primary)

References for CVE-2021-30350

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