Vulnerability Details : CVE-2021-30340
Reachable assertion due to improper validation of coreset in PDCCH configuration in SA mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Products affected by CVE-2021-30340
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa515m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9360_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcx315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx65_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2021-30340
0.09%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 38 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2021-30340
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.8
|
HIGH | AV:N/AC:L/Au:N/C:N/I:N/A:C |
10.0
|
6.9
|
NIST | |
7.5
|
HIGH | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H |
3.9
|
3.6
|
NIST | |
7.5
|
HIGH | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H |
3.9
|
3.6
|
Qualcomm, Inc. |
CWE ids for CVE-2021-30340
-
The product contains an assert() or similar statement that can be triggered by an attacker, which leads to an application exit or other behavior that is more severe than necessary.Assigned by: nvd@nist.gov (Primary)
References for CVE-2021-30340
-
https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin
Qualcomm DocumentationVendor Advisory
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