Vulnerability Details : CVE-2021-30316
Possible out of bound memory access due to improper boundary check while creating HSYNC fence in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Vulnerability category: Overflow
Products affected by CVE-2021-30316
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa415m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa515m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3990_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd720g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9360_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fsm10055_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fsm10056_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd678_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcx315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx12_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2021-30316
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2021-30316
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.2
|
HIGH | AV:L/AC:L/Au:N/C:C/I:C/A:C |
3.9
|
10.0
|
NIST | |
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST | |
8.4
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
2.5
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2021-30316
-
The product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.Assigned by: nvd@nist.gov (Primary)
References for CVE-2021-30316
-
https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin
October 2021 Security Bulletin | QualcommPatch;Vendor Advisory
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