Vulnerability Details : CVE-2020-11306
Possible integer overflow in RPMB counter due to lack of length check on user provided data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Vulnerability category: Overflow
Products affected by CVE-2020-11306
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3990_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qsm8350_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qsm8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9984_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_8c_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd720g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd730_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd7c_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9360_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9371_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3910_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3999_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:whs9410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd678_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2020-11306
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2020-11306
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
4.6
|
MEDIUM | AV:L/AC:L/Au:N/C:P/I:P/A:P |
3.9
|
6.4
|
NIST | |
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST | |
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
Qualcomm, Inc. |
CWE ids for CVE-2020-11306
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The product performs a calculation that can produce an integer overflow or wraparound when the logic assumes that the resulting value will always be larger than the original value. This occurs when an integer value is incremented to a value that is too large to store in the associated representation. When this occurs, the value may become a very small or negative number.Assigned by: nvd@nist.gov (Primary)
References for CVE-2020-11306
-
https://www.qualcomm.com/company/product-security/bulletins/june-2021-bulletin
June 2021 Security Bulletin | QualcommVendor Advisory
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