Vulnerability Details : CVE-2020-11202
Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P
Vulnerability category: OverflowMemory Corruption
Products affected by CVE-2020-11202
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs603_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx50m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda670_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2020-11202
0.09%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 38 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2020-11202
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.2
|
HIGH | AV:L/AC:L/Au:N/C:C/I:C/A:C |
3.9
|
10.0
|
NIST | |
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST |
CWE ids for CVE-2020-11202
-
The product writes data past the end, or before the beginning, of the intended buffer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2020-11202
-
https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
Page not foundBroken Link;Vendor Advisory
-
https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
Pwn2Own Qualcomm DSP - Check Point ResearchExploit;Third Party Advisory
-
https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
Achilles: Small chip, big peril. - Check Point SoftwareThird Party Advisory
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