Vulnerability Details : CVE-2020-11175
u'Use after free issue in Bluetooth transport driver when a method in the object is accessed after the object has been deleted due to improper timer handling.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009W, MSM8909W, QCS605, QM215, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA855, SDM1000, SDM640, SDM670, SDM710, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6350, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SXR1120, SXR1130, SXR2130, SXR2130P
Vulnerability category: Memory Corruption
Products affected by CVE-2020-11175
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8009w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx50m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6350_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7225_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1120_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2020-11175
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 8 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2020-11175
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.2
|
HIGH | AV:L/AC:L/Au:N/C:C/I:C/A:C |
3.9
|
10.0
|
NIST | |
7.8
|
HIGH | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST |
CWE ids for CVE-2020-11175
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The product reuses or references memory after it has been freed. At some point afterward, the memory may be allocated again and saved in another pointer, while the original pointer references a location somewhere within the new allocation. Any operations using the original pointer are no longer valid because the memory "belongs" to the code that operates on the new pointer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2020-11175
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https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
Page not foundVendor Advisory
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