Vulnerability Details : CVE-2019-2302
While processing vendor command which contains corrupted channel count, an integer overflow occurs and finally will lead to heap overflow. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8017, APQ8053, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8976, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS405, QCS605, SDA845, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM8150
Vulnerability category: OverflowMemory Corruption
Products affected by CVE-2019-2302
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8976_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2019-2302
0.40%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 58 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2019-2302
| Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
|---|---|---|---|---|---|---|
|
7.5
|
HIGH | AV:N/AC:L/Au:N/C:P/I:P/A:P |
10.0
|
6.4
|
NIST | |
|
9.8
|
CRITICAL | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
3.9
|
5.9
|
NIST |
CWE ids for CVE-2019-2302
-
The product performs a calculation that can produce an integer overflow or wraparound when the logic assumes that the resulting value will always be larger than the original value. This occurs when an integer value is incremented to a value that is too large to store in the associated representation. When this occurs, the value may become a very small or negative number.Assigned by: nvd@nist.gov (Primary)
-
The product writes data past the end, or before the beginning, of the intended buffer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2019-2302
-
https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin
October Security Bulletin 2019 | Qualcomm
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