Vulnerability Details : CVE-2019-2299
An out-of-bound write can be triggered by a specially-crafted command supplied by a userspace application. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA8081, QCA9377, QCA9379, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM660, SDX20, SDX24
Vulnerability category: Memory Corruption
Products affected by CVE-2019-2299
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_600_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2019-2299
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2019-2299
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
4.6
|
MEDIUM | AV:L/AC:L/Au:N/C:P/I:P/A:P |
3.9
|
6.4
|
NIST | |
7.8
|
HIGH | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST |
CWE ids for CVE-2019-2299
-
The product writes data past the end, or before the beginning, of the intended buffer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2019-2299
-
https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin
July 2019 Code Aurora Security Bulletin - Code AuroraPatch;Third Party Advisory
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