Vulnerability Details : CVE-2019-19196
Potential exploit
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.
Vulnerability category: OverflowDenial of service
Products affected by CVE-2019-19196
- cpe:2.3:a:telink-semi:tlsr8258_ble_sdk:*:*:*:*:*:*:*:*
- cpe:2.3:a:telink-semi:tlsr8269_ble_sdk:*:*:*:*:*:*:*:*
- cpe:2.3:a:telink-semi:tlsr8253_ble_sdk:*:*:*:*:*:*:*:*
- cpe:2.3:a:telink-semi:tlsr8251_ble_sdk:*:*:*:*:*:*:*:*
- cpe:2.3:a:telink-semi:tlsr8232_ble_sdk:*:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2019-19196
0.09%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 37 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2019-19196
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
3.3
|
LOW | AV:A/AC:L/Au:N/C:N/I:N/A:P |
6.5
|
2.9
|
NIST | |
6.5
|
MEDIUM | CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H |
2.8
|
3.6
|
NIST |
CWE ids for CVE-2019-19196
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: nvd@nist.gov (Primary)
References for CVE-2019-19196
-
http://www.telink-semi.com/ble
ble.png (150×150)Vendor Advisory
-
https://asset-group.github.io/disclosures/sweyntooth/
ASSET Research Group: SweynToothExploit;Third Party Advisory
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