Vulnerability Details : CVE-2019-17517
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.
Vulnerability category: Overflow
Products affected by CVE-2019-17517
- cpe:2.3:a:dialog-semiconductor:software_development_kit:*:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2019-17517
0.21%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 44 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2019-17517
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
6.1
|
MEDIUM | AV:A/AC:L/Au:N/C:N/I:N/A:C |
6.5
|
6.9
|
NIST | |
5.7
|
MEDIUM | CVSS:3.1/AV:A/AC:L/PR:N/UI:R/S:U/C:N/I:N/A:H |
2.1
|
3.6
|
NIST |
CWE ids for CVE-2019-17517
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: nvd@nist.gov (Primary)
References for CVE-2019-17517
-
https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-energy/smartbond-da14580-and-da14583
SmartBond™ DA14580 and DA14583 | Dialog SemiconductorThird Party Advisory
-
https://asset-group.github.io/disclosures/sweyntooth/
ASSET Research Group: SweynToothThird Party Advisory
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