Vulnerability Details : CVE-2019-14112
Potential buffer overflow while processing CBF frames due to lack of check of buffer length before copy in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130
Vulnerability category: Overflow
Products affected by CVE-2019-14112
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2019-14112
0.36%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 55 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2019-14112
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
10.0
|
HIGH | AV:N/AC:L/Au:N/C:C/I:C/A:C |
10.0
|
10.0
|
NIST | |
9.8
|
CRITICAL | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
3.9
|
5.9
|
NIST |
CWE ids for CVE-2019-14112
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: nvd@nist.gov (Primary)
References for CVE-2019-14112
-
https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin
April 2020 Security Bulletin | QualcommVendor Advisory
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