Vulnerability Details : CVE-2019-14095
Buffer overflow occurs while processing LMP packet in which name length parameter exceeds value specified in BT-specification in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8016, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6390, QCA6574AU, QCA9377, QCA9379, QCA9886, QCM2150, QCN7605, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, Saipan, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Vulnerability category: Overflow
Products affected by CVE-2019-14095
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9886_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8939_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:saipan_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8076_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8016_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2019-14095
0.38%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 56 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2019-14095
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
10.0
|
HIGH | AV:N/AC:L/Au:N/C:C/I:C/A:C |
10.0
|
10.0
|
NIST | |
9.8
|
CRITICAL | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
3.9
|
5.9
|
NIST |
CWE ids for CVE-2019-14095
-
The product copies an input buffer to an output buffer without verifying that the size of the input buffer is less than the size of the output buffer, leading to a buffer overflow.Assigned by: nvd@nist.gov (Primary)
References for CVE-2019-14095
-
https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin
March 2020 Security Bulletin | QualcommVendor Advisory
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