There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
Published 2019-02-11 15:29:01
Updated 2019-02-14 18:21:02
View at NVD,   CVE.org
Vulnerability category: OverflowMemory Corruption

Products affected by CVE-2018-13888

Exploit prediction scoring system (EPSS) score for CVE-2018-13888

0.04%
Probability of exploitation activity in the next 30 days EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less

CVSS scores for CVE-2018-13888

Base Score Base Severity CVSS Vector Exploitability Score Impact Score Score Source First Seen
7.2
HIGH AV:L/AC:L/Au:N/C:C/I:C/A:C
3.9
10.0
NIST
7.8
HIGH CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
1.8
5.9
NIST

CWE ids for CVE-2018-13888

  • The product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.
    Assigned by: nvd@nist.gov (Primary)

References for CVE-2018-13888

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