In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Published 2018-09-20 13:29:01
Updated 2019-10-03 00:03:26
View at NVD,   CVE.org

Exploit prediction scoring system (EPSS) score for CVE-2018-11277

0.04%
Probability of exploitation activity in the next 30 days EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less

CVSS scores for CVE-2018-11277

Base Score Base Severity CVSS Vector Exploitability Score Impact Score Score Source First Seen
4.6
MEDIUM AV:L/AC:L/Au:N/C:P/I:P/A:P
3.9
6.4
NIST
7.8
HIGH CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
1.8
5.9
NIST

CWE ids for CVE-2018-11277

References for CVE-2018-11277

Products affected by CVE-2018-11277

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