Vulnerability Details : CVE-2018-11269
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
Vulnerability category: Overflow
Products affected by CVE-2018-11269
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2018-11269
0.05%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 14 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2018-11269
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.2
|
HIGH | AV:L/AC:L/Au:N/C:C/I:C/A:C |
3.9
|
10.0
|
NIST | |
7.8
|
HIGH | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST |
CWE ids for CVE-2018-11269
-
The product uses untrusted input when calculating or using an array index, but the product does not validate or incorrectly validates the index to ensure the index references a valid position within the array.Assigned by: nvd@nist.gov (Primary)
References for CVE-2018-11269
-
https://www.qualcomm.com/company/product-security/bulletins
Security Advisories | Product Security | QualcommVendor Advisory
-
http://www.securityfocus.com/bid/105838
Qualcomm Closed-Source Components Multiple Unspecified VulnerabilitiesThird Party Advisory;VDB Entry
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