Vulnerability Details : CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Published 2019-05-06 23:29:00
Updated 2019-05-07 15:58:12
Source Qualcomm, Inc.
View at NVD,   CVE.org
Vulnerability category: Memory Corruption

Exploit prediction scoring system (EPSS) score for CVE-2017-18157

EPSS FAQ
0.04%
Probability of exploitation activity in the next 30 days EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less

CVSS scores for CVE-2017-18157

Base Score Base Severity CVSS Vector Exploitability Score Impact Score Score Source First Seen
7.2
 HIGH AV:L/AC:L/Au:N/C:C/I:C/A:C
3.9
10.0
 NIST
7.8
 HIGH CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
1.8
5.9
 NIST

CWE ids for CVE-2017-18157

  • The product reuses or references memory after it has been freed. At some point afterward, the memory may be allocated again and saved in another pointer, while the original pointer references a location somewhere within the new allocation. Any operations using the original pointer are no longer valid because the memory "belongs" to the code that operates on the new pointer.
    Assigned by: nvd@nist.gov (Primary)

References for CVE-2017-18157

Products affected by CVE-2017-18157

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