Vulnerability Details : CVE-2017-18141
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
Products affected by CVE-2017-18141
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
Exploit prediction scoring system (EPSS) score for CVE-2017-18141
0.04%
Probability of exploitation activity in the next 30 days
EPSS Score History
~ 10 %
Percentile, the proportion of vulnerabilities that are scored at or less
CVSS scores for CVE-2017-18141
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source | First Seen |
---|---|---|---|---|---|---|
7.2
|
HIGH | AV:L/AC:L/Au:N/C:C/I:C/A:C |
3.9
|
10.0
|
NIST | |
7.8
|
HIGH | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
1.8
|
5.9
|
NIST |
References for CVE-2017-18141
-
http://www.securityfocus.com/bid/106128
Qualcomm Closed-Source Components Multiple Unspecified VulnerabilitiesThird Party Advisory;VDB Entry
-
https://www.qualcomm.com/company/product-security/bulletins
Security Advisories | Product Security | QualcommVendor Advisory
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