Vulnerability Details : CVE-2016-10435
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9625, MDM9635M, MDM9640, MDM9645, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 820, and SD 820A, in some QTEE syscall handlers, a TOCTOU vulnerability exists.
Exploit prediction scoring system (EPSS) score for CVE-2016-10435
Probability of exploitation activity in the next 30 days: 0.19%
Percentile, the proportion of vulnerabilities that are scored at or less: ~ 55 % EPSS Score History EPSS FAQ
CVSS scores for CVE-2016-10435
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source |
---|---|---|---|---|---|
9.3
|
HIGH | AV:N/AC:M/Au:N/C:C/I:C/A:C |
8.6
|
10.0
|
NIST |
8.1
|
HIGH | CVSS:3.0/AV:N/AC:H/PR:N/UI:N/S:U/C:H/I:H/A:H |
2.2
|
5.9
|
NIST |
CWE ids for CVE-2016-10435
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The product contains a code sequence that can run concurrently with other code, and the code sequence requires temporary, exclusive access to a shared resource, but a timing window exists in which the shared resource can be modified by another code sequence that is operating concurrently.Assigned by: nvd@nist.gov (Primary)
References for CVE-2016-10435
-
https://source.android.com/security/bulletin/2018-04-01
Android Security Bulletin—April 2018 | Android Open Source ProjectVendor Advisory
-
http://www.securityfocus.com/bid/103671
Google Android Multiple Qualcomm Components Multiple Unspecified Security VulnerabilitiesThird Party Advisory;VDB Entry
Products affected by CVE-2016-10435
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*