Vulnerability Details : CVE-2015-9126
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, and SDX20, possible buffer overflow when processing 1X circuit service message.
Vulnerability category: Overflow
Exploit prediction scoring system (EPSS) score for CVE-2015-9126
Probability of exploitation activity in the next 30 days: 0.19%
Percentile, the proportion of vulnerabilities that are scored at or less: ~ 55 % EPSS Score History EPSS FAQ
CVSS scores for CVE-2015-9126
Base Score | Base Severity | CVSS Vector | Exploitability Score | Impact Score | Score Source |
---|---|---|---|---|---|
10.0
|
HIGH | AV:N/AC:L/Au:N/C:C/I:C/A:C |
10.0
|
10.0
|
NIST |
9.8
|
CRITICAL | CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H |
3.9
|
5.9
|
NIST |
CWE ids for CVE-2015-9126
-
The product performs operations on a memory buffer, but it can read from or write to a memory location that is outside of the intended boundary of the buffer.Assigned by: nvd@nist.gov (Primary)
References for CVE-2015-9126
-
https://source.android.com/security/bulletin/2018-04-01
Android Security Bulletin—April 2018 | Android Open Source ProjectVendor Advisory
-
http://www.securityfocus.com/bid/103671
Google Android Multiple Qualcomm Components Multiple Unspecified Security VulnerabilitiesThird Party Advisory;VDB Entry
Products affected by CVE-2015-9126
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*